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Author / Viking Technology

Aerospace & Defense

Ultra-Dense DDR4 Military Multi-Chip Package (MCP) Parallel Cell

November 16, 2020 by Viking Technology 0 comments

Viking Technology’s Multi-Chip Package (MCP) is part of the extreme density line of DDR4 memory products optimized for the embedded, industrial, and military/aerospace markets. ParallelCell products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs. A full sized 16GB module […]

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2950 Red Hill Avenue
Costa Mesa, CA 92626
714-913-2200

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https://www.vikingtechnology.com

Viking Technology supplies leading edge Non-Volatile DIMMs (NVDIMM), Solid State Drives (SSD) and DRAM memory modules along with state-of-the-art multi-chip memory packaging (MCP) solutions and storage class memory (ReRAM & MRAM) for the Enterprise, Industrial, Telecommunications, and Military markets. Comprehensive memory product offerings include Enterprise Class & Industrial Grade SSDs available across a wide portfolio of standard and OEM customized form-factors (2.5”, 1.8” SlimSATA, mSATA, M.2, PCIe/NVMe SSDs, Discrete Flash Cards, eUSB). Viking also supports the broadest range of DDR4, DDR3, DDR2, DDR and SDRAM modules. Viking Technology’s Parallel family of Packaged products are multi-chip package (MCP) solutions that are bare die and wafer level stacked, capable of reducing the overall footprint of memory modules into a single chip. These MCP solutions are military tested, defense avionics ready with future generations optimized for radiation tolerant and space compliant.

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